Wafer Level Packaging Market Share 2021: Global Trends, Key Players, Industry Analysis Report to 2027

The Wafer Level Packaging Market size is expected to grow at an annual average of 20% during 2021-2027. Wafer-level packaging (WLP) is used to interconnect electronic components such as resistors, capacitors, transistors, etc. on a single chip to create integrated circuits and utilize solder bumps deposited on chip pads. WLP allows wafer manufacturing, packaging, testing, and burn-in to be integrated at the wafer level to streamline the manufacturing process performed on the device.

The following segmentation are covered in this report:

By Integration Type

• Fan-in WLP
• Fan-out WLP

By Industry

• Electronics
• IT & Telecommunication
• Industrial
• Automotive
• Aerospace & Defense
• Healthcare
• Others (Media & Entertainment and Non-Conventional Energy Resources)

By Bumping Technology

• Copper Pillar
• Solder Bumping
• Gold Bumping
• Others (Aluminum & Conductive Polymer Bumping)

Company Profile

• Amkor Technology
• Applied Materials, Inc.
• Brewer Science, Inc.
• Deca Technologies
• Fujitsu
• Infineon Technologies AG
• LAM RESEARCH CORPORATION
• Siliconware Precision Industries Co., Ltd.
• STATS ChipPAC Ltd
• Tokyo Electron Limited

Scope of the report

The research study analyses the Wafer Level Packaging Market industry from 360-degree analysis of the market thoroughly delivering insights into the market for better business decisions, considering multiple aspects some of which are listed below as:

Recent developments

• Market overview and growth analysis
• Import and export overview
• Volume analysis
• Current market trends and future outlook
• Market opportunistic and attractive investment segment

Geographic coverage

• North america market size and/or volume
• Latin america market size and/or volume
• Europe market size and/or volume
• Asia-pacific market size and/or volume
• Rest of the world market size and/or volume

Key Questions Answered by Wafer Level Packaging Market Report

• What was the Wafer Level Packaging Market size in 2019 and 2020; what are the estimated growth trends and market forecast (2021-2027)
• What will be the CAGR of Market during the forecast period (2021-2027)?
• Which segments (product type/applications/end-user) were most attractive for investments in 2021? How these segments are expected to grow during the forecast period (2021-2027).
• Which manufacturer/vendor/players in the Wafer Level Packaging Market was the market leader in 2020?
• Overview on the existing product portfolio, products in the pipeline, and strategic initiatives taken by key vendors in the market.